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Discovered in 2016, this technology now makes it possible to bind different types of glass to metals such as stainless steels, medical titanium and superconducting alloys. ICB can also be used to bind technical ceramics to metals.

This discovery was initiated as part of a CTI project between HE-Arc and a Swiss luxury watchmaking group to provide a solution and innovation in the field of assembly. This is an innovative breakthrough technology that allows a perfect atomic bond between substrates and therefore avoids the use of adhesives, soldering or any other binder.

This joining method, called ICB, is now part of the existing methods for the high-tech microtechnology assemblies (bonding in microsystem technology) and offers completely new alternatives to traditional anodic bonding or direct bonding techniques. The new ICB technology is a low temperature process that allows materials with very different expansion coefficients to be bonded. Little sensitive to dust and surface conditions, this process of binding between substrates is currently carried out in an industrial environment and is thus free of not only a controlled environment but also the polishing stage.